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The influence of cutting compound on the technics of incising TiN/Si3N4 nano diphase ceramic[J]. MW Metal Cutting, 2008, (21): 21-22.
Citation: The influence of cutting compound on the technics of incising TiN/Si3N4 nano diphase ceramic[J]. MW Metal Cutting, 2008, (21): 21-22.
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The influence of cutting compound on the technics of incising TiN/Si3N4 nano diphase ceramic

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